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Three-dimensional circuit technology was of great interest in the early to mid-1980s. The proponents for this technology, however, realized the mistake of trying to make it directly competitive with conventional flat circuits and have developed a niche where the substrate also offers other functional uses, such as structural support for the product. Manufacturers of three-dimensional circuits prefer to call them molded interconnection devices (MIDs). In many applications of MIDs, the number of components to interconnect the electronic and electrical components can be reduced, thus making the total assembly cost cheaper and the final structure more reliable.

In 1953, the Motorola Corporation developed a PTH process called the Placir method,1 in which the entire surface and hole walls of an unclad panel are sensitized with SnCl2 and metallized by spraying on silver with a two-gun spray Next, the panel is screened with a reverse conductor pattern, using a plating resist ink, leaving metallized conductor traces uncovered The panel is then plated with copper by an electroplating method Finally, the resist ink is stripped and the base silver removed to complete the PTH board One problem associated with the use of silver is the migration caused by silver traces underneath the copper conductors The Placir method was the forerunner of the semiadditive process, which is discussed in Chap 31 In 1955, Fred Pearlstein2 published a process involving electroless nickel plating for metallizing nonconductive materialsThis catalyzer consists of two steps.

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First, the panel is sensitized in SnCl2 solution, and then it is activated in PdCl2 solution This process presented no problem for metallizing nonconductive materials At the same time that Pearlstein s paper was published, copper-clad laminates were starting to become popular Manufacturers of PWBs applied this two-step catalyzing process to making PTHs using copper-clad laminates This process, however, turned out to be incompatible with the copper surface A myriad of black palladium particles called smads were generated between copper foil and electrolessly deposited copper, resulting in poor adhesion between the electroless copper and the copper foil These smads and electroless copper had to be brushed off with strong abrasive action before the secondary electroplating process could begin To overcome this smad problem, around 1960 researchers began attempting to develop better catalysts; the products of their research were the predecessors of modern palladium catalysts.

3 The mid-1950s was a busy time in the area of electroless copper-plating solutions Electrolessly deposited nickel is difficult to etch But since it adheres somewhat better to the base than does electroless copper, research for the development of stable electroless copperplating solutions was quite natural Many patent applications for these solutions were filled in the mid-1950s Among the applicants were P B Atkinson, Sam Wein, and a team of General Electric engineers, Luke, Cahill, and Agens Atkinson won the case, and a patent4 teaching the use of Cu-EDTA as a complexing agent was issued in January 1964 (the application had been filed in September 1956)..

Subtractive and Additive Processes Photocircuits Corporation was another company engaged throughout the 1950s in the development of chemicals for PTH processes. Copper-clad laminates were expensive, and a major

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portion of expensive copper foil had to be etched (subtracted) to form the desired conductor pattern.The engineers at Photocircuits, therefore, concerned themselves with plating (adding) copper conductors wherever necessary on unclad materials for the sake of economy. Their efforts paid off. They were successful in developing not only the essential chemicals for reliable PTH processes but also the fully additive PWB manufacturing technology known as the CC-4* process. This process is discussed in detail in Chap. 31. With the use of SnCl2-PdCl2 catalysts and EDTA-base electroless copper-plating solutions, the modern PTH processes became firmly established in the 1960s. The process of metallizing hole walls with these chemicals for the subsequent formation of PTHs is commonly called the copper reduction process. In the subtractive method, which begins with copper-clad laminates, pattern plating and panel plating are the two most widely practiced methods of making PTH boards. These methods are discussed in the following subsections.

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