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Mask Removal Mask materials should be removed carefully; to prevent peeling, it may be desirable to score or cut the coating at the edge of the mask so that the coating tears along the correct line. Ensure that the mask is removed entirely and that no residue has been left behind on the board. Latex mask that has been overheated will be sticky and difficult to remove completely, as will overheated masking tapes.

Since the different varieties of available coatings vary widely in their properties, removal methods must be evaluated and developed on practice boards first before being used on deliverable CCAs. The coating can then be removed as easily as possible, with the least risk to the CCA. Several methods to remove conformal coating are:

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Similarly, this can be repeated for other gauge pressure ratios Therefore, the following can be obtained: at l/L = 1/4, Kg = 08; Airflow = 045 scfm (00127 m3/min) The mass flow is independent of the number of jets and is inversely proportional to the lengthto-diameter ratio and the feed hole station The correction factor for different length-to-diameter ratios and location of the rows of jets are given in Figure 752 For the one-eighth station feeding, a correction can be made based on Figure 752 (b) The value of 2 is read from the vertical axis of the intersection of l/L (0125) and the curve The correction value is multiplied by the airflow at l/L (025) at l/L = 1/8, Kg = 06; Airflow = 0840 scfm (00238 m3/min) at l/L = 1/8, Kg = 08; Airflow = 1326 scfm (00375 m3/min) The choices of the one-eighth station feedings are not possible at the available flow rate Thus, the final choice will be two rows of eight feed holes at the quarter station From Figure 745, the intersection of the feed hole diameter with the diametrical clearance will give the gauge pressure ratio, which may be interpolated The best diameter is the one that gives a lower gauge pressure ratio A feed hole diameter of 50 10 3 in is to be preferred since it provides the lowest gauge pressure ratio and Fig 752: Variation of the mass flow with the bearing geometry [3] airflow However, feed holes of a larger diameter up to 60 10 3 in can be used without jeopardizing the performance of the aerostatic bearing The final design is summarized in Table 73 and illustrated in Figure 753 The performance is scaled down taking into consideration a safety factor Slot Feeding Slot-fed bearings can help in overcoming the effect of dispersion and non-axial flow that are dominant in reducing the load capacity and stiffness for the jet-fed bearings Circumferential feed slots can.

Using a solvent to loosen or dissolve the coating Using a hot soldering iron or hot-air nozzle to solder through the coating while simultaneously removing the offending electrical part Mechanically cutting, abrading, or picking away the coating Etching the coating away using rarefied gas plasma (typically for XY coating only)

Solvent The easiest coatings to remove are acrylics, since they do not react when they are applied. For local coating removal, the area to be repaired can be cotton swabbed several times with the proper solvent. Care must be taken to keep the solvent only in areas that are to have the coating removed. The entire board may be stripped of coating with a solvent soak. This is most useful on acrylic coatings, but is also possible for some urethanes and silicones, which swell and loosen when soaked. Note that this process may damage the components or solder joints on the board, which will be stressed as the expanding coating pushes up the components. The solvent may attack the components and PWB itself; epoxy coatings cannot be removed with solvent or chemical strippers, since many parts and the PWB are also made of epoxy.

Thermal Thin coatings may be loosened from solder joints with a soldering iron or a hot-air reflow tool, while the faulty part is being desoldered. The area is then cleaned of charred and or damaged coating, and the repair completed. Although this method is simple, it usually produces toxic gases, and must be performed with adequate ventilation.The decomposed coating is also difficult to clean off of the board and soldering iron.

CPUs require a reset pulse after the power supply has stabilized. The basic requirement is that a processor reset pulse should appear after the power supply has settled to a stable value. This is to initialize the internal registers and the control circuit. Usually, the processor has a power-on reset circuit as well as an external reset input circuit. The power-on reset circuit activates when the power supply voltage is below a certain threshold. After some

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